? semiconductor components industries, llc, 2010 september, 2010 ? rev. 2 1 publication order number: nsr01l30/d nsr01l30nxt5g schottky barrier diode these schottky barrier diodes are optimized for low forward voltage drop and low leakage current. the dsn2 (dual silicon no ? lead) package is a chip level package using solderable metal contacts under the package similar to dfn style packages. the dsn style package enables 100% utilization of the package area for active silicon, offering a significant performance per board area advantage compared to products in plastic molded packages. the low thermal resistance enables designers to meet the challenging task of achieving higher efficiency and meeting reduced space requirements. features ? very low forward voltage drop ? 400 mv @ 10 ma ? low reverse current ? 0.2 a @ 10 v vr ? 100 ma of continuous forward current ? esd rating ? human body model: class 3b esd rating ? machine model: class c ? power dissipation of 312 mw with minimum trace ? very high switching speed ? low capacitance ? ct = 7 pf ? this is a halide ? free device ? this is a pb ? free device typical applications ? lcd and keypad backlighting ? camera photo flash ? buck and boost dc ? dc converters ? reverse voltage and current protection ? clamping & protection markets ? mobile handsets ? mp3 players ? digital camera and camcorders ? notebook pcs & pdas ? gps maximum ratings rating symbol value unit reverse voltage v r 30 v forward current (dc) i f 100 ma forward surge current (60 hz @ 1 cycle) i fsm 4.0 a esd rating: human body model machine model esd >8.0 >400 kv v stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above the recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may affect device reliability. 30 v schottky barrier diode 1 cathode 2 anode http://onsemi.com device package shipping ? ordering information nsr01l30nxt5g dsn2 (pb ? free) 5000 / tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specification s brochure, brd8011/d. dsn2 (0201) case 152aa marking diagram pin 1 i130 = specific device code yyy = year code i130 yyy
nsr01l30nxt5g http://onsemi.com 2 thermal characteristics characteristic symbol min typ max unit thermal resistance junction ? to ? ambient (note 1) total power dissipation @ t a = 25 c r ja p d 400 312 c/w mw thermal resistance junction ? to ? ambient (note 2) total power dissipation @ t a = 25 c r ja p d 170 735 c/w mw storage temperature range t stg ? 40 to +125 c junction temperature t j +150 c 1. mounted onto a 4 in square fr ? 4 board 10 mm sq. 1 oz. cu 0.06? thick single sided. operating to steady state. 2. mounted onto a 4 in square fr ? 4 board 1 in sq. 1 oz. cu 0.06? thick single sided. operating to steady state. electrical characteristics (t a = 25 c unless otherwise noted) characteristic symbol min typ max unit reverse leakage (v r = 10 v) (v r = 30 v) i r 0.2 3.0 a forward voltage (i f = 10 ma) (i f = 100 ma) v f 0.40 0.53 v total capacitance (v r = 5.0 v, f = 1 mhz) ct 7.0 pf
nsr01l30nxt5g http://onsemi.com 3 typical characteristics figure 1. forward voltage figure 2. leakage current v f , forward voltage (v) v r , reverse voltage (v) 0.6 0.5 0.4 0.3 0.1 0 0.001 0.01 0.1 1 10 100 30 25 20 15 10 5 0 1.0e ? 05 1.0e ? 03 1.0e ? 01 1.0e+01 1.0e+03 figure 3. total capacitance v r , reverse voltage (v) 25 20 15 10 5 0 0 2 4 6 8 10 12 14 i f , forward current (ma) i r , reverse current ( a) c t , total capacitance (pf) 0.2 150 c 125 c ? 25 c 75 c 25 c 150 c 125 c ? 25 c 75 c 25 c 30 t a = 25 c 16 18 20 1.0e ? 04 1.0e ? 02 1.0e+00 1.0e+02
nsr01l30nxt5g http://onsemi.com 4 package dimensions dsn2, 0.6x0.3, 0.4p, (0201) case 152aa ? 01 issue o notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. a b e d bottom view b e 2x 0.05 b a c l 2x 2x 0.06 c top view 2x 0.06 c 2x a a1 0.05 c 0.05 c c seating plane side view dim min max millimeters a 0.24 0.30 a1 0.00 0.01 b 0.22 0.28 d 0.30 bsc e 0.60 bsc e 0.40 bsc l 0.12 0.18 mounting footprint* dimensions: millimeters 0.75 0.28 0.30 0.28 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. 2 1 see application note and8398/d for more mounting details on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5773 ? 3850 nsr01l30/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loca l sales representative
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